Co-support component and microelectronic assembly

ABSTRACT

A component may be configured for connection with a microelectronic assembly having terminals and a microelectronic element connected with the terminals. The component may include a support structure bearing conductors configured to carry command and address information, and a plurality of contacts coupled to the conductors and configured for connection with the terminals. The contacts may have address and command information assignments arranged according to a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and according to a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. patent applicationSer. No. 13/595,486, filed Aug. 27, 2012, the disclosure of which ishereby incorporated herein by reference. The following co-owned andco-pending U.S. patent applications are hereby incorporated herein byreference: “Co-Support Module and Microelectronic Assembly,” naminginventors Richard Crisp et al. (Attorney Docket No. TIPI 3.12-834 B),“Co-Support System and Microelectronic Assembly,” naming inventorsRichard Crisp et al. (Attorney Docket No. TIPI 3.12-834 C), and“Co-Support Circuit Panel and Microelectronic Packages,” naminginventors Richard Crisp et al. (Attorney Docket No. TIPI 3.0-834 CIP),each filed on even date herewith.

BACKGROUND OF THE INVENTION

The subject matter of the present application relates to microelectronicstructures, e.g., structures incorporating active circuit elements, suchas, without limitation, structures including at least one semiconductorchip or portion of at least one semiconductor chip, as well asassemblies incorporating microelectronic structures.

Semiconductor chips are commonly provided as individual, prepackagedunits. A standard chip has a flat, rectangular body with a large frontface having contacts connected to the internal circuitry of the chip.Each individual chip typically is contained in a package having externalterminals connected to the contacts of the chip. In turn, the terminals,i.e., the external connection points of the package, are configured toelectrically connect to a circuit panel, such as a printed circuitboard. In many conventional designs, the chip package occupies an areaof the circuit panel considerably larger than the area of the chipitself. As used in this disclosure with reference to a flat chip havinga front face, the “area of the chip” should be understood as referringto the area of the front face.

Size is a significant consideration in any physical arrangement ofchips. The demand for more compact physical arrangements of chips hasbecome even more intense with the rapid progress of portable electronicdevices. Merely by way of example, devices commonly referred to as“smart phones” integrate the functions of a cellular telephone withpowerful data processors, memory and ancillary devices such as globalpositioning system receivers, electronic cameras, and local area networkconnections along with high-resolution displays and associated imageprocessing chips. Such devices can provide capabilities such as fullinternet connectivity, entertainment including full-resolution video,navigation, electronic banking and more, all in a pocket-size device.Complex portable devices require packing numerous chips into a smallspace. Moreover, some of the chips have many input and outputconnections, commonly referred to as “I/Os.” These I/Os must beinterconnected with the I/Os of other chips. The components which formthe interconnections should not greatly increase the size of theassembly. Similar needs arise in other applications as, for example, indata servers such as those used in internet search engines whereincreased performance and size reduction are needed.

Microelectronic elements such as semiconductor chips which containmemory storage arrays, particularly dynamic random access memory chips(DRAMs) and flash memory chips, are commonly packaged in single- ormultiple-chip packages and assemblies. Each package has many electricalconnections for carrying signals, power and ground between terminals andthe microelectronic elements, e.g., chips therein. The electricalconnections can include different kinds of conductors such as horizontalconductors, e.g., traces, beam leads, etc., which extend in a horizontaldirection relative to a contact-bearing surface of a chip, verticalconductors such as vias, which extend in a vertical direction relativeto the surface of the chip, and wire bonds which extend in bothhorizontal and vertical directions relative to the surface of the chip.

Conventional microelectronic packages can incorporate a microelectronicelement having active elements defining a memory storage array. Thus, insome conventional microelectronic elements, transistors or other activeelements, constitute a memory storage array with or without additionalelements. In some cases, the microelectronic element can be configuredto predominantly provide memory storage array function, i.e., in whichcase microelectronic element may embody a greater number of activeelements to provide memory storage array function than any otherfunction. In some cases, a microelectronic element may be or include aDRAM chip, or may be or include a stacked electrically interconnectedassembly of such semiconductor chips. Typically, all of the terminals ofsuch package are placed in sets of columns adjacent to one or moreperipheral edges of a package substrate to which the microelectronicelement is mounted.

Conventional circuit panels or other microelectronic components aretypically configured to be coupled to a microelectronic package havingone or more first type microelectronic elements therein. Such circuitpanels or other microelectronic components typically cannot be coupledto a microelectronic package having one or more microelectronic elementstherein that are of a different or second type.

In light of the foregoing, certain improvements in the design of circuitpanels or other microelectronic components can be made in order toimprove the functional flexibility thereof, particularly in circuitpanels or other microelectronic components to which packages can bemounted and electrically interconnected with one another.

SUMMARY OF THE INVENTION

In accordance with an aspect of the invention, a component can beconfigured for connection with a microelectronic assembly which includesa set of terminals and a microelectronic element having a memory storagearray having a given number of storage locations, the microelectronicelement of the assembly having inputs connected with the terminals forreceiving command and address information specifying one of the storagelocations. The component can include a support structure bearing a setof conductors configured to carry the command and address information,and a plurality of contacts coupled to the set of conductors, thecontacts configured for connection with corresponding ones of theterminals of the microelectronic assembly.

The contacts can have address and command information assignmentsarranged according to a first predetermined arrangement for connectionwith a first type of the microelectronic assembly in which themicroelectronic element is configured to sample the command and addressinformation coupled thereto through the contacts at a first samplingrate, the contacts having a first number thereof. The contacts can haveaddress and command information assignments arranged according to asecond predetermined arrangement for connection with a second type ofthe microelectronic assembly in which the microelectronic element isconfigured to sample the command and address information coupled theretothrough a subset of the contacts including a second number of thecontacts at a second sampling rate being greater than the first samplingrate, the subset including some contacts occupying identical positionswith the contacts that are assigned to the first predeterminedarrangement, the second number being fewer than the first number.

In one example, all of the contacts of the subset of contacts arrangedaccording to the second predetermined arrangement can occupy identicalpositions with the contacts that are assigned to the first predeterminedarrangement. In one embodiment, the second sampling rate can be aninteger multiple of the first sampling rate. In a particular example,the component can also include a device coupled to the set ofconductors, the device being operable to drive the command and addressinformation to the contacts. In an exemplary embodiment, the device canbe a microprocessor. In one example, the device can be a bufferingelement. In a particular embodiment, the device can be configured tooperate in each of first and second modes for connection of thecomponent with the first type microelectronic assembly via the firstarrangement, and with the second type microelectronic assembly via thesecond arrangement, respectively.

In a particular example, the component can also include the first typemicroelectronic assembly, wherein the contacts are electricallyconnected with the terminals. In one embodiment, the component can alsoinclude the second type microelectronic assembly, wherein the contactsare electrically connected with the terminals. In an exemplaryembodiment, the component can be a circuit panel, and the contacts canbe exposed at a surface of the circuit panel. In one example, themicroelectronic assembly can be a microelectronic package, and whereinthe terminals can be surface mount terminals and can be exposed at asurface of the microelectronic package. In a particular embodiment, thecomponent can be a circuit panel, and the contacts can be disposed in asocket electrically connected with the circuit panel.

In an exemplary embodiment, the microelectronic assembly can include amodule card having first and second opposed surfaces. The terminals canbe a plurality of parallel exposed terminals at at least one of thefirst and second surfaces for mating with the contacts of the socketwhen the module is inserted in the socket. In one embodiment, thecomponent can be a circuit panel and the contacts can be disposed in aconnector electrically connected with the circuit panel. Themicroelectronic assembly can include a module card having first andsecond opposed surfaces. The terminals can be a plurality of terminalsexposed at one of the first and second surfaces for mating with thecontacts of the connector when the module is attached to the connector.

In a particular example, the microelectronic assembly can be a firstmicroelectronic assembly and the component can be a secondmicroelectronic assembly, and the contacts can be terminals of thesecond microelectronic assembly. In one example, the secondmicroelectronic assembly can be coupled to the support structure and caninclude a microelectronic element having active devices therein. Theterminals of the second microelectronic assembly can be coupled with themicroelectronic element of the second microelectronic assembly byelectrical connections that extend only within the secondmicroelectronic assembly.

In a particular embodiment, the electrical connections between theterminals of the second microelectronic assembly and the microelectronicelement of the second microelectronic assembly can includeinterconnection elements extending in a direction normal to a surface ofthe second microelectronic assembly at which the terminals of the secondmicroelectronic assembly are exposed. The interconnection elements canbe configured for package-on-package stacking. In one embodiment, theelectrical connections between the terminals of the secondmicroelectronic assembly and the microelectronic element of the secondmicroelectronic assembly can include a bond via array extending from theterminals of the second microelectronic assembly to contacts exposed ata surface of a substrate of the second microelectronic assembly.

In a particular example, the second microelectronic assembly can becoupled to the support structure and can include a microelectronicelement having active devices therein. The terminals of the secondmicroelectronic assembly can be exposed at a surface of themicroelectronic element of the second microelectronic assembly. In anexemplary embodiment, the microelectronic element of the secondmicroelectronic assembly can be a first microelectronic element. Thesecond microelectronic assembly can also include at least one secondmicroelectronic element each having active devices therein. The firstand second microelectronic elements can be arranged in a stackedconfiguration. In one example, the terminals of the secondmicroelectronic assembly can be electrically connected with the set ofconductors of the support structures by through-silicon vias extendingthrough the at least one second microelectronic element.

In a particular embodiment, the microelectronic element of the secondmicroelectronic assembly can include a logic function. In oneembodiment, the contacts can be first contacts and the conductors can bea first set of conductors. The component can also include a plurality ofsecond contacts coupled to a second set of conductors. The secondcontacts can be configured for connection with corresponding terminalsof the microelectronic assembly. The second contacts can be configuredto carry information other than the command and address information. Ina particular example, the contacts can be first contacts and theconductors can be a first set of conductors. The component can alsoinclude a plurality of power and ground contacts coupled to a second setof conductors. The power and ground contacts can be configured forconnection with corresponding terminals of the microelectronic assembly.The power and ground contacts can be configured to carry a powerpotential and a reference potential, respectively.

In an exemplary embodiment, when the first contacts have assignmentsarranged according to the second predetermined arrangement, themicroelectronic element of the second type of the microelectronicassembly can be configured to connect with the power and groundcontacts, the power and ground contacts having a third number thereof.When the first contacts have assignments arranged according to the firstpredetermined arrangement, the microelectronic element of the first typeof the microelectronic assembly can be configured to connect with asubset of the power and ground contacts including a fourth number of thepower and ground contacts, the fourth number being fewer than the thirdnumber.

In one example, the microelectronic element in the first type of themicroelectronic assembly can be of type DDRx. In a particularembodiment, the microelectronic element in the second type of themicroelectronic assembly can be of type LPDDRx. In one embodiment, themicroelectronic element in the first type of the microelectronicassembly can be of type GDDRx. In a particular example, a system caninclude a component as described above and one or more other electroniccomponents electrically connected to the component. In an exemplaryembodiment, the system can also include a housing, the component and theone or more other electronic components being assembled with thehousing.

In accordance with another aspect of the invention, a component can beconfigured for connection with a microelectronic assembly which includesa set of terminals and a microelectronic element having a memory storagearray having a given number of storage locations, the microelectronicelement of the assembly having inputs connected with the terminals forreceiving command and address information specifying one of the storagelocations. The component can include a support structure bearing a setof conductors configured to carry the command and address information,and a plurality of contacts coupled to the set of conductors, thecontacts configured for connection with corresponding ones of theterminals of the microelectronic assembly.

The contacts can have address and command information assignmentsarranged according to a first predetermined arrangement for connectionwith a first type of the microelectronic assembly in which themicroelectronic element is configured to sample the command and addressinformation coupled thereto through a first subset of the contactsincluding a first number of the contacts. The contacts can have addressand command information assignments arranged according to a secondpredetermined arrangement for connection with a second type of themicroelectronic assembly in which the microelectronic element isconfigured to sample the command and address information coupled theretothrough a second subset of the contacts including a second number of thecontacts, the first and second subsets including some contacts occupyingidentical positions, the second number being fewer than the firstnumber.

In one example, the command and address information of the first type ofthe microelectronic assembly can include parity information, themicroelectronic element in the first type of the microelectronicassembly can be configured to sample the parity information, and thesecond subset of the contacts for connection with the second type of themicroelectronic assembly may not be configured to sample the parityinformation. In an exemplary embodiment, the microelectronic element inthe second type of the microelectronic assembly can be of type DDR3, andthe microelectronic element in the first type of the microelectronicassembly can be of type DDR4.

In one embodiment, the command and address information of the first typeof the microelectronic assembly having the DDR4 type microelectronicelement can include parity information, and the DDR4 typemicroelectronic element in the first type of the microelectronicassembly can be configured to sample the parity information. In aparticular example, the microelectronic element in the second type ofthe microelectronic assembly can be of type DDRx, and themicroelectronic element in the first type of the microelectronicassembly can be of type DDR(x+1).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating a component according to anembodiment of the invention.

FIG. 2A is a side sectional view illustrating a component having amicroelectronic package and a circuit panel according to an embodimentof the invention.

FIG. 2B is a side sectional view illustrating a component having amicroelectronic package and a module card according to an embodiment ofthe invention.

FIG. 2C is a side sectional view illustrating a component having a firsttype microelectronic package and a circuit panel according to anembodiment of the invention.

FIG. 2D is a side sectional view illustrating a component having asecond type microelectronic package and a circuit panel according to anembodiment of the invention.

FIG. 3A is a side sectional view illustrating a component having amodule and a circuit panel according to an embodiment of the invention.

FIG. 3B is a side sectional view illustrating a component having amodule and a circuit panel according to a variation of the embodiment ofthe invention seen in FIG. 3A.

FIG. 3C is a perspective view illustrating the module card of FIG. 3Ahaving various potential configurations of terminals.

FIG. 4A is a side sectional view illustrating a component having apackage-on-package structure and a circuit panel according to anembodiment of the invention.

FIG. 4B is a side sectional view illustrating a component having apackage-on-package structure according to an embodiment of theinvention.

FIG. 4C is a side sectional view illustrating a component having apackage-on-package structure according to an embodiment of theinvention.

FIG. 5A is a side sectional view illustrating a component having amicroelectronic package, a TSV stack, and a circuit panel according toan embodiment of the invention.

FIG. 5B is a side sectional view illustrating a component having amicroelectronic package and a TSV stack according to an embodiment ofthe invention.

FIG. 6 is a schematic sectional view illustrating a system according toan embodiment of the invention.

FIG. 7 is a schematic sectional view illustrating a system according toan embodiment of the invention.

DETAILED DESCRIPTION

A component 5 according to an embodiment of the invention is illustratedin FIG. 1. As seen in FIG. 1, the component 5 is configured to beconnected with a microelectronic assembly 10.

The microelectronic assembly 10 includes a set of terminals 25 and amicroelectronic element 30 having a memory storage array having a givennumber of storage locations. The microelectronic element 30 has elementcontacts 35 including inputs 35 a connected with the terminals 25 forreceiving command and address information specifying one of the storagelocations, and other element contacts 35 b for sending and receivinginformation other than the command and address information (e.g., datainformation). The microelectronic assembly 10 can take various forms,for example, as described below with reference to FIGS. 2-5.

The microelectronic assembly 10 can include active elements, e.g.,active devices such as transistors, or other active elements thereon,which, with or without additional elements, define a memory storagearray. In one example, the active elements and the memory storage arraydefined by the active elements can be incorporated in a portion of amicroelectronic element 30, or in one or more microelectronic elements,e.g., one or more semiconductor chips, of the microelectronic assembly10, or may be incorporated in one or more microelectronic packages ofthe microelectronic assembly.

Without limitation, in one example, the microelectronic assembly 10 maybe, for example, a microelectronic package or portion thereof whereinthe terminals 25 are exposed at a surface of the microelectronicpackage. In another example, the microelectronic assembly can include aplurality of electrically connected microelectronic packages or astructure that includes electrically connected microelectronic elements,semiconductor chips, or portions of microelectronic elements orsemiconductor chips, or portions of microelectronic packages.

As used herein, a statement that an electrically conductive element is“exposed at” a surface of a structure indicates that the electricallyconductive element is available for contact with a theoretical pointmoving in a direction perpendicular to the surface toward the surfacefrom outside the structure. Thus, a terminal or other conductive elementwhich is exposed at a surface of a structure can project from suchsurface; can be flush with such surface; or can be recessed relative tosuch surface and exposed through a hole or depression in the structure.

In one example, the memory storage array of the one or moremicroelectronic elements 30 comprises a functional part of themicroelectronic assembly 10 whose role may be subservient to anotherfunctional part of the microelectronic assembly. For example, themicroelectronic assembly 10 may include a logic functional part, e.g.,processor, and a memory functional part, and the memory functional partmay assist with or help serve a function of the logic functional part.However, in a particular example, the microelectronic assembly 10 may beconfigured to predominantly provide memory storage array function. Inthe latter case, the microelectronic assembly 10 may have a greaternumber of active elements, e.g., active devices such as transistors,configured to provide memory storage array function than the number ofactive elements in other components of the microelectronic assembly thatare configured to provide function other than memory storage arrayfunction.

In one example, the microelectronic assembly 10 may contain wiringtherein that directly electrically couples a set of the terminals 25,e.g., “first terminals” 25 a, with corresponding address inputs 35 a ofthe microelectronic element 30. As used herein, each “first terminal” 25a has a signal assignment on the microelectronic assembly 10 thatincludes one or more of the address inputs 35 a. In another example, asfurther described below, the microelectronic assembly 10 may include abuffer element, such as a semiconductor chip having a plurality ofactive elements thereon, such semiconductor chip being configured to atleast one of regenerate, or partially or fully decode at least one ofaddress or command information received at the terminals 25 for transferby the microelectronic structure to the address inputs. Commandinformation may be information that controls an operating mode of amemory storage array or portion thereof within the microelectronicassembly 10.

The microelectronic assembly 10 is configured to provide addressinformation received at the first terminals 25 a to the address inputs35 a of the one or more microelectronic elements 30. As used herein inthe context of address information or command address bus information orsignals and the address inputs of a microelectronic element or portionthereof, a statement that address information on terminals is “providedto address inputs” means that the address information on the terminalsis transferred to the address inputs via electrical connectionstherewith, or through a buffer element which may perform at least one ofregenerating, partially decoding or decoding of the address informationreceived at the terminals.

In one type of such microelectronic element 30, each one of somecontacts of the address inputs 35 a may be configured to receiveparticular address information of the address information supplied tothe microelectronic element. In a particular embodiment, each of suchcontacts may be an address input 35 a configured to receive addressinformation, supplied to the microelectronic element 30 from outside themicroelectronic element, i.e., through wiring of the microelectronicpackage 10 such as wire bonds, and through the first terminals 25 a.Contacts of the microelectronic elements 30 may also be configured toreceive other information or signals from outside the microelectronicelement.

For example, when the microelectronic element 30 includes or is a DRAMsemiconductor chip, the first terminals 25 a can be configured to carryaddress information transferred to the microelectronic assembly 10 thatis usable by circuitry within the microelectronic assembly, e.g., rowaddress and column address decoders, and bank selection circuitry, ifpresent, to determine an addressable memory location from among all theavailable addressable memory locations of a memory storage array withina microelectronic element in the microelectronic assembly. In aparticular embodiment, the first terminals 25 a can be configured tocarry all the address information used by such circuitry within themicroelectronic assembly 10 to determine an addressable memory locationwithin such memory storage array. Each of the first terminals 25 a canbe configured to carry address information sufficient to specify alocation within the memory storage array of the microelectronic assembly10.

Typically, when the microelectronic element 30 in the microelectronicassembly 10 is or includes a DRAM chip, the address information in oneembodiment can include all address information transferred to themicroelectronic assembly from a component external to themicroelectronic structure, e.g., the component 5, which is used fordetermining a random access addressable memory location within themicroelectronic assembly for read access thereto, or for either read orwrite access thereto.

In a particular embodiment, the first terminals 25 a can be configuredto carry information that controls an operating mode of one or more ofthe microelectronic elements 30. More specifically, the first terminals25 a can be configured to carry all of a particular set of commandsignals and/or clock signals transferred to the microelectronic assembly10. In one embodiment, the first terminals 25 a can be configured tocarry all of the command signals, address signals, bank address signals,and clock signals transferred to the assembly 10 from an externalcomponent, e.g., the component 5, wherein the command signals includerow address strobe, column address strobe and write enable.

In an embodiment in which one or more of the microelectronic elements 30are configured to provide dynamic memory storage array function, such asprovided by a dynamic random access memory (“DRAM”) semiconductor chip,or an assembly of DRAM chips, the command signals can be write enable,row address strobe, and column address strobe signals. Other signalssuch as ODT (on die termination), chip select, clock enable, may or maynot be carried by the first terminals 25 a. The clock signals can beclocks used by one or more of the microelectronic elements for samplingthe address signals.

In addition to the first terminals 25 a, the terminals (or the terminalsin any of the other embodiments described herein) can also includesecond terminals 25 b that are configured to carry (send and/or receive)information other than the command and address information, such as datasignals. At least some of the second terminals 25 b can be configured tocarry signals other than the address signals that are carried by thefirst terminals 25 a. In particular examples, the second terminals 25 bmay carry one or more of data, data strobe signals, or other signals orreference potentials such as chip select, reset, power supply voltages,e.g., Vdd, Vddq, and ground, e.g., Vss and Vssq. The second terminals 25b may be electrically connected with the other element contacts 35 b forsending and receiving information other than the command and addressinformation.

In one example, the second terminals 25 b can include terminals used forcarrying uni-directional or bi-directional data signals to and or fromthe microelectronic elements 30, and data strobe signals, as well asdata masks and ODT or “on die termination” signals used to turn on oroff parallel terminations to termination resistors. In particularexamples, the second terminals 25 b may carry signals such as reset, aswell as reference potentials such as power supply voltages, e.g., Vdd,Vddq, or ground, e.g., Vss and Vssq.

In one particular example of such microelectronic element 30, thecommand and address information present at the element contacts 35 a canbe sampled relative to an edge of a clock used by the respectivemicroelectronic element, i.e., upon on a transition of the clock betweenfirst and second different voltage states. That is, each command andaddress signal can be sampled upon a rising transition between a lowervoltage state and a higher voltage state of the clock, or upon a fallingtransition between a higher voltage state and a lower voltage state ofthe clock. Thus, the plurality of command and address signals may all besampled upon the rising transition of the clock, or such command andaddress signals may all be sampled upon the falling transition of theclock, or in another example, the command or address signal at one ofthe element contacts 35 a can be sampled upon the rising transition ofthe clock and the command or address signal at one other externalcontact can be sampled upon the falling transition of the clock.

In another type of microelectronic element 30, which may be configuredto predominantly provide memory storage array function, one or more ofthe command or address address contacts 35 a thereon can be used in amultiplexed manner. In this example, a particular element contact 35 aof the respective microelectronic element 30 can receive two or moredifferent signals supplied to the microelectronic element from theoutside. Thus, a first command or address address signal can be sampledat the particular contact 35 a upon a first transition of the clockbetween the first and second different voltage states (e.g., a risingtransition), and a signal other than the first command or addressaddress signal can be sampled at the particular contact upon a secondtransition of the clock (e.g., a falling transition) between the firstand second voltage states that is opposite the first transition.

In such a multiplexed manner, two different signals can be receivedwithin the same cycle of the clock on the same element contact 35 a ofthe respective microelectronic element 30. In a particular case,multiplexing in this manner can allow a first address command or addresssignal and a different signal to be received in the same clock cycle onthe same element contact 35 a of the respective microelectronic element30. In yet another example, multiplexing in this manner can allow afirst command or address signal and a second different command oraddress signal to be received in the same clock cycle on the sameelement contact 35 a of the respective microelectronic element 30.

In one example, the operational parameters may pertain to timing such asthe number of clock cycles of latency after the row address strobesignal is detected in an enabled state by circuitry of themicroelectronic assembly 10 (hereinafter, “RAS latency”), or may pertainto the number of clock cycles of latency after the column address strobesignal is detected in an enabled state by circuitry of themicroelectronic assembly, or may pertain to the capacity of themicroelectronic assembly, e.g., such as one gigabit (“1 Gb”), twogigabit (“2 Gb”), etc., or may pertain to the organization of themicroelectronic assembly, such as a “single-rank”, “2-rank”, “4-rank” orother structure, etc., or other operating parameter, or a combination ofthe foregoing operational parameters, or other operating parameter. Inone example, the nonvolatile memory may store information of a singleone of the aforementioned parameters or may store information of anycombination of the operational parameters, without limitation. In aparticular example, the nonvolatile memory may contain a table of knownbad memory locations within the memory storage array of themicroelectronic assembly 10 which should be avoided during read or writeaccess to the memory storage array.

The component 5 includes a support structure 60 (e.g., a circuit panel)bearing a first set of conductors 70 configured to carry the command andaddress information. The support structure 60 can take many differentforms, such as a circuit panel 160 (FIG. 2A), a module card 160 b (FIG.2B), an interconnection substrate 342 (FIG. 4B), a molded region 348(FIG. 4C), a microelectronic element 440 (FIG. 5B), or a dielectriclayer overlying a microelectronic element (not shown), among others.

The component 5 also includes a plurality of first contacts 65 coupledto the set of conductors 70 and configured for connection withcorresponding ones of the terminals 25 of the microelectronic assembly10. The first set of conductors 70 can include at least one bus having aplurality of signal lines configured to carry all of the addressinformation transferred to the first contacts 65. The first contacts 65can be electrically connected with the at least one bus of the first setof conductors 70.

The connection between the contacts 65 of the component 5 and theterminals 25 of the microelectronic assembly 10 can take various forms,for example, as described below with reference to FIGS. 2-5. Thecontacts 65 have a plurality of predetermined arrangements of addressand command information assignments, so that the contacts can beconnected with terminals 25 of a microelectronic assembly 10 having oneor more microelectronic elements 30 of a plurality of types (e.g., DDRx,GDDRx, LPDDRx, etc.).

The contacts 65 are arranged according to a first predeterminedarrangement for connection with a first type of the microelectronicassembly 10 in which the one or more microelectronic elements 30 areconfigured to sample the command and address information coupled theretothrough a first subset of the contacts including a first number of thecontacts (which may be some or all of the contacts) at a first samplingrate (e.g., DDR3 or DDR4). The same contacts 65 can be arrangedaccording to a second predetermined arrangement for connection with asecond type of microelectronic assembly 10 in which the one or moremicroelectronic elements 30 are configured to sample the command andaddress information coupled thereto through a second subset of thecontacts including a second number of the contacts fewer than the firstnumber at a second sampling rate being greater than the first samplingrate (e.g., LPDDR3). The first and second subsets of the contacts 65include some contacts occupying identical positions. The contacts 65that can be arranged according to two different predeterminedarrangements for connection with two different types of themicroelectronic assembly 10, respectively, are also referred to hereinas “co-support contacts.”

In a particular embodiment, the second sampling rate can be an integermultiple of the first sampling rate. For example, the component 5 may beconfigured such that when a first type of the microelectronic assembly10 having DDR3 or DDR4 memory therein is attached to the component, themicroelectronic elements 30 in the microelectronic assembly can beconfigured to sample the command and address information coupled theretothrough a first number of the contacts 65 at a first sampling rate, suchas once per clock cycle (e.g., on the rising edge of the clock cycle).In this same example, the component 5 may be configured such that when asecond type of the microelectronic assembly 10 having LPDDR3 memorytherein is attached to the component, the microelectronic elements 30 inthe microelectronic assembly can be configured to sample the command andaddress information coupled thereto through a second number of thecontacts 65 at a second sampling rate, such as twice per clock cycle(e.g., once each on the rising edge and falling edge of the clockcycle). Therefore, in this example, the second sampling rate is aninteger multiple (2) of the first sampling rate.

In another embodiment where the second sampling rate is an integermultiple of the first sampling rate, the component may be configuredsuch that when a first type of the microelectronic assembly 10 havingDDR3 or DDR4 memory therein is attached to the component, themicroelectronic elements 30 in the microelectronic assembly can beconfigured to sample the command and address information coupled theretothrough a first number of the contacts 65 at a first sampling rate ofonce per clock cycle. In this same example, the component 5 may beconfigured such that when a second type of the microelectronic assembly10 having a different type of memory therein is attached to thecomponent, the microelectronic elements 30 in the microelectronicassembly can be configured to sample the command and address informationcoupled thereto through a second number of the contacts 65 at a secondsampling rate of four times per clock cycle (e.g., once each on everyquarter of the clock cycle). Therefore, in this example, the secondsampling rate is also an integer multiple (4) of the first samplingrate.

In yet another embodiment, the second sampling rate can be a non-integermultiple of the first sampling rate. For example, the component 5 may beconfigured such that when a first type of the microelectronic assembly10 having memory therein is attached to the component, themicroelectronic elements 30 in the microelectronic assembly can beconfigured to sample the command and address information coupled theretothrough a first number of the contacts 65 at a first sampling rate offour times per clock cycle (e.g., once each on every quarter of theclock cycle). In this same example, the component 5 may be configuredsuch that when a second type of the microelectronic assembly 10 havingmemory therein is attached to the component, the microelectronicelements 30 in the microelectronic assembly can be configured to samplethe command and address information coupled thereto through a secondnumber of the contacts 65 at a second sampling rate of six times perclock cycle (e.g., once each on every sixth of the clock cycle).Therefore, in this example, the second sampling rate is a non-integermultiple (1.5) of the first sampling rate.

In another embodiment where the second sampling rate is a non-integermultiple of the first sampling rate, such a non-integer relationshipbetween the first and second sampling rates can occur when sampling ofthe command and address information by the microelectronic elements 30is only performed during some clock cycles but not other clock cycles.For example, the component 5 may be configured such that when a firsttype of the microelectronic assembly 10 having DDR3 or DDR4 memorytherein is attached to the component, the microelectronic elements 30 inthe microelectronic assembly can be configured to sample the command andaddress information coupled thereto through a first number of thecontacts 65 at a first sampling rate of one time every other clockcycle. In this same example, the component 5 may be configured such thatwhen a second type of the microelectronic assembly 10 having anothertype of memory therein is attached to the component, the microelectronicelements 30 in the microelectronic assembly can be configured to samplethe command and address information coupled thereto through a secondnumber of the contacts 65 at a second sampling rate of two times everythird clock cycle (e.g., once each on the rising edge and falling edgeof every third clock cycle). Therefore, in this example, the secondsampling rate is a non-integer multiple (1.5) of the first samplingrate.

Besides the specific examples described above, the inventioncontemplates many other integer and non-integer multiple relationshipsbetween the second sampling rate and the first sampling rate, inexamples where sampling of the command and address information by themicroelectronic elements 30 is performed during every clock cycle, andin examples where sampling of the command and address information by themicroelectronic elements is only performed during some clock cycles butnot other clock cycles.

In one example, the same predetermined arrangement of contacts 65 of thecomponent 5 can be used to connect with first type microelectronicassemblies 10 that include microelectronic elements which operateaccording to the industry standard DDR3 or DDR4 specification, or toconnect with second type microelectronic structures that includemicroelectronic elements compliant with the industry standard LPDDR3specification.

In an examples shown herein, in the second type of microelectronicassembly 10, which samples command and address information using fewercontacts 60 than the first type, some of the terminals 25 can beno-connect terminals that may not be needed to transfer addressinformation to the address inputs 35 a of one or more memory storagearrays in the microelectronic assembly 10.

As used herein, a “no-connect terminal” of a microelectronic assemblymeans a terminal that is not connected in any electrical path, e.g.,path for conducting information to any microelectronic element 30, e.g.,semiconductor chip, within the microelectronic assembly 10, whether ornot there is ever any information present on such no-connect terminal.Thus, even if information may be present on a no-connect terminal suchas may be coupled thereto from the component 5 that is connected to theno-connect terminal, the information present on the no-connect terminalis not in any path to be provided to any microelectronic element 30within the microelectronic assembly 10.

In any of the embodiments herein, in addition to the first contacts 65,the component 5 can also include a plurality of second contacts 67coupled to a second set of conductors 71 and configured for connectionwith corresponding ones of the second terminals 25 b of themicroelectronic assembly 10. The second contacts 67 can be configuredfor connection with corresponding second terminals 25 b of themicroelectronic assembly 10, the second contacts being configured tocarry information other than the command and address information, suchas data signals. The second set of conductors 71 can have at least onesecond bus that is electrically connected with at least some of thesecond contacts 67. Such a second bus can have a plurality of signallines configured to carry information other than the address and commandinformation.

The component 5 can also include a device 80 coupled to the set ofconductors, the device operable to drive the command and addressinformation to the contacts. In one example, the device 80 can be adriving element electrically connected to the set of conductors 70. Thedevice 80 can be, for example, a microprocessor or a direct memoryaccess controller (“DMA controller”). In a particular embodiment, thedevice 80 can be a buffering element, or a protocol converter that isconfigured to convert address information having a first protocol thatcan be used by the component 5 to a second protocol that can be used bythe particular type of microelectronic element 30 in the microelectronicassembly 10. The device 80 can be configured to operate in each of firstand second modes for connection of the component 5 with the first typemicroelectronic assembly 10 via the first arrangement of address andcommand information assignments, and with the second typemicroelectronic assembly via the second arrangement of address andcommand information assignments, respectively.

In a particular example, the device 80 can be at least one centralprocessing unit (“CPU”), the CPU configured to control operations of aplurality of components in the system including read operations from themicroelectronic assembly 10 and write operations to the microelectronicassembly. The component 5 may include more than one device 80, includingboth a direct memory access controller and a CPU, for example. In oneembodiment, the component 5 can further include a power supplyconfigured to supply power for use by the component and themicroelectronic assembly 10.

Although FIG. 1 shows only a single microelectronic assembly 10electrically connected with the component 5, in other embodiments, aplurality of microelectronic assemblies can be electrically connectedwith the component.

FIG. 2A illustrates a component 105 according to a particular example ofthe invention shown in FIG. 1. As seen in FIG. 2A, the component 105includes a circuit panel 160, and the contacts 165 are exposed at afirst surface 161 of the circuit panel. The circuit panel 160 (and thecircuit panel in other embodiments described herein) can be of varioustypes, such as a printed circuit board used in a dual-inline memorymodule (“DIMM”) module, a circuit board or panel to be connected withother components in a system, or a motherboard, among others.

The microelectronic assembly joined to the circuit panel 160 is in theform of a microelectronic package 110. The microelectronic package 110has one or more microelectronic elements 130 therein having a surfacefacing a first surface 121 of a package substrate 120. Themicroelectronic element 130 has address inputs 135 electricallyconnected to terminals 125 exposed at a second surface 122 of thesubstrate 120 opposite the first surface 121. The second surface 122 isan exposed surface of the microelectronic package 110. The terminals 125can be surface mount terminals (e.g., of type BGA, LGA, PGA, etc.).

Although FIG. 2A shows only a single microelectronic package 110electrically connected with the component 105, in other embodiments, aplurality of microelectronic packages can be electrically connected withthe component. In such embodiments, all of the microelectronic packages110 can be attached to the first surface 161 of the circuit panel 160,all of the microelectronic packages can be attached to the secondsurface 162 of the circuit panel, or one or more microelectronicpackages can be attached to the first surface of the circuit panel andone or more microelectronic packages can be attached to the secondsurface.

The microelectronic package 110 may have a plurality of address inputs135 for receipt of address information specifying locations within thememory storage array. Thus, the address inputs 135 may be contactsexposed at a surface of a microelectronic element 130 as describedabove. The microelectronic package 110 is configured so as to transferaddress information received at particular terminals 125 of themicroelectronic structure to the address inputs 135. For example, themicroelectronic package 110 may couple signals received on particularterminals 125 of the structure to corresponding particular addressinputs 135.

In a particular example, the address inputs 135 can be exposed at a faceof a microelectronic element 130, e.g., a semiconductor chip, whereinthe face faces towards the first surface 121 of the substrate 120. Inanother example, the address inputs 135 can be exposed at a face of amicroelectronic element 130 that faces away from the first surface 121.In some cases, when the address inputs 135 are exposed at a face of themicroelectronic element 130 that faces away from the first surface 121,a die attach adhesive may be disposed between a rear face of themicroelectronic element and the first surface 121 of the substrate 120,which may mechanically reinforce the connection between themicroelectronic element and the substrate.

As further seen in the particular example in FIG. 2A, a microelectronicelement 130 incorporated in the microelectronic assembly 110 may haveelement contacts 135 at a face thereof that are electrically connectedto respective substrate contacts 124 at the first surface 121 or thesecond surface 122 of the substrate 120. In one example, themicroelectronic element 130 can be flip-chip bonded to the substrate 120via conductive joining elements extending between element contacts 135of the microelectronic element and corresponding substrate contacts 124at the first surface 121 of the substrate 120.

In another example, wire bonds may extend through openings in thesubstrate 120 and may electrically connect the element contacts 135 withsubstrate contacts at the second surface 122 of the substrate.Alternatively, other types of conductors, e.g., portions of a leadframe, flexible ribbon bonds, etc., may be used to electrically connectthe element contacts 135 with the respective substrate contacts 124,which in some cases may connect the element contacts with otherconductive elements disposed at a greater height from the front surface121 than the front face of the microelectronic element 130.

In some embodiments, the contacts 135 may in some cases be connectedwith active devices of the semiconductor chip 130 through back end ofline (“BEOL”) wiring of the semiconductor which may include vias orother electrically conductive structure and which may in some cases bedisposed underneath the contacts 135.

The terminals 125 (and any of the other terminals described herein) canbe electrically conductive elements, e.g., contacts, pads, posts, pins,sockets, wiring, or other electrically conductive structure that areexposed at a first surface 112 of the microelectronic package 110, whichin the example shown in FIG. 2A, is the same surface as the secondsurface 122 of the substrate 120.

In some cases, the terminals 125 can be configured to be conductivelybonded to corresponding contacts 165 of another element such as thecircuit panel 160, such as with a conductive joining element 111. Theconductive joining elements 111 may include a bond metal of a fusibleconductive material such as solder, tin, indium, gold, a eutecticmaterial, an electrically conductive matrix material containing metaland polymeric material, among others, or other conductive bond material,and may in some cases also include additional structure such as aconductive bump attached to conductive structure of the substrate 120such as conductive pads or posts. In other cases, the terminals 125 canbe configured to mechanically and electrically engage correspondingfeatures of the circuit panel 160, such as by a pressure or interferencefit between corresponding conductive elements of each component, whichin some cases, may slide or wipe relative to corresponding conductivesurfaces they engage. The terminals 125 can be electrically connectedwith the substrate contacts 124 through electrically conductivestructure on the substrate 120, such as traces and vias, for example.

As shown in FIG. 2A, electrically conductive joining units 111 (e.g.,solder balls) can extend between all of the terminals 125 of themicroelectronic assembly and corresponding circuit panel contacts 165.However, in an embodiment in which some of the terminals 125 of themicroelectric assembly 110 are no-connect terminals (e.g., when themicroelectronic element is of the second type, such as LPDDR3), suchno-connect terminals may be connected to corresponding circuit panelcontacts 65 while not being connected within the microelectronicassembly 110 in any electrical path for conductive information to amicroelectronic element 130 within the microelectronic assembly.

In some embodiments, the substrate 120 (or any of the other packagesubstrates described herein) and/or the circuit panel 160 (or any of theother circuit panels described herein) shown in FIG. 2A can include asheet-like or board-like dielectric element, which may consistessentially of polymeric material, e.g., a resin or polyimide, amongothers. Alternatively, the substrate 120 and/or the circuit panel 160can include a dielectric element having a composite construction such asglass-reinforced epoxy, e.g., of BT resin or FR-4 construction. In someexamples, the dielectric element of the substrate 120 and/or the circuitpanel 160 can have a coefficient of thermal expansion in the plane ofthe dielectric element, i.e., in a direction parallel to a first surface110 thereof, of up to 30 parts per million per degree Celsius(hereinafter, “ppm/° C.”).

In another example, the substrate 120 can include a supporting elementof material having a coefficient of thermal expansion (“CTE”) of lessthan 12 parts per million per degree Celsius, on which the terminals 125and other conductive structure can be disposed. For example, suchlow-CTE element can consist essentially of glass, ceramic, orsemiconductor material or liquid crystal polymer material, or acombination of such materials.

In one example, the set of conductors 170 can include at least one busthat can extend in a first direction X parallel to the first surface 161of the circuit panel 160. In a particular example, the at least one busof the set of conductors 170 can extend in a second direction Y parallelto the first surface 160 of the circuit panel 160, the second directionbeing transverse to the first direction X. In some embodiments, thesignal lines of the busses of the set of conductors 170 can be locatedin the same plane as one another, and each individual signal line caninclude conductor portions extending in a plurality of planes and in aplurality of directions.

The at least one bus of the set of conductors 170 can have a pluralityof signal lines configured to carry all of the address informationtransferred to the contacts 165 of the circuit panel 160. The contacts165 can be electrically connected with the at least one bus of the setof conductors 170. In one example, the at least one bus of the set ofconductors 170 can be configured to carry all of the command signalstransferred to the contacts 165, the command signals including writeenable, row address strobe, and column address strobe signals.

The circuit panel 160 can optionally include one or more terminationresistors, which can be connected to a terminal voltage source. One ormore of the plurality of signal lines of one or more of the busses ofthe set of conductors 170 can optionally be electrically connected to atermination resistor.

The contacts 165 shown in FIG. 2A can be arranged according to apredetermined arrangement that defines relative positions on the firstsurface 161 of the circuit panel 160 (or the second surface 162 if thecontacts 165 are exposed at the second surface) of contacts carryingaddress and command information and data.

The circuit panel 160 can be usable without requiring alteration thereofin first and second modes, each mode being when a given set of thecontacts 165 is connected with terminals of a corresponding type ofmicroelectronic package 110. For example, a component 105 can include acircuit panel 160 and a first type microelectronic package 110 havingfirst terminals 125 joined to first contacts 165 of the circuit panel.In another example, a component 5 can include a circuit panel 160 and asecond type microelectronic package 110 having first terminals 125joined to first contacts 165 of the circuit panel.

For example, in the first mode, the circuit panel 160 can be coupled toa first type of microelectronic package 110 that is operable to samplethe address and command information carried by the first contacts 165once per clock cycle. Such microelectronic packages may be of type DDR3or DDR4 for example, or of type GDDR3, GDDR4 or GDDR5.

There is a progression of standards relating to double data rate DRAMmemory and low power double data rate DRAM, and graphics double datarate DRAM memory that are expected to continue in the future for sometime to come. The present and future standards starting with the DDR3standard, the LPDDR3 standard and the GDDR3 standard are referred toherein collectively as “DDRx”, “LPDDRx” and “GDDRx,” respectively.

In a particular example, in the second mode, the circuit panel 160 canbe coupled to a second type of microelectronic package 110 that isoperable to sample the address and command information carried by thefirst contacts 165 twice per clock cycle. Such microelectronic packages110 may be of type LPDDRx, e.g., LPDDR3 or LPDDR4 among existing andplanned standards.

In one embodiment, circuit panel 160 can be coupled to a first type ofmicroelectronic package 110 using a first subset of the first contacts165, and the same circuit panel can be coupled to a second type ofmicroelectronic package using a second subset of the first contacts, thesecond subset having a fewer number of contacts than the first subset.In such an embodiment, the first type of microelectronic package 110 canbe is operable to sample the address and command information carried bythe first subset of the first contacts 165 the same number of times perclock cycle (e.g., once per clock cycle) as the second type ofmicroelectronic package 110 can be operable to sample the address andcommand information carried by the second subset of the first contacts.

In this embodiment, the first type of microelectronic package 110 canhave microelectronic elements of type DDR4, and the second type ofmicroelectronic package can have microelectronic elements of type DDR3.The first subset of the first contacts 165 can include some contactsconfigured to carry command and address information that is not carriedby the second subset of the first contacts, such as, for example,ALERT_N (an I/O signal that can be an output used to signal a parityerror), BG (bank group signals), a parity bit input to the chip PAR,sampled just like any other command-address signal, ACT input, and DRAM,which checks the parity based on the information received by the chip,which includes the address information, the PAR bit, and the commandinfo received (i.e., RAS, CAS, ACT (activate an active low signal)).Furthermore, although there are fewer contacts in the second subset offirst contacts 165 than in the first subset, the second subset of firstcontacts can include three bank address signals (for use with DDR3microelectronic elements), while the first subset of the first contactscan include two bank address signals (for use with DDR4 microelectronicelements).

In a particular embodiment, the one or more microelectronic elements 130in the first type microelectronic package can incorporate a differenttype of memory storage array than the one or more microelectronicelements in the second type microelectronic package. In another example,the circuit panel 160 can be coupled to another type of microelectronicpackage 110 that is operable to sample the address and commandinformation carried by the first contacts 165 four times per clockcycle.

In the embodiment of FIG. 2A, in one example, such as when a first typemicroelectronic package 110 includes a plurality of microelectronicelements 130, all of the microelectronic elements of the first typemicroelectronic package can be configured to connect with the same setof conductors 170 that is configured to carry a single set ofcommand-address signals. In such an embodiment, the component 105 may beconfigured such that when a first type of the microelectronic package100 having DDR3 or DDR4 memory therein is attached to the component, themicroelectronic elements 130 in the microelectronic package can beconfigured to sample the command and address information coupled theretothrough a first number of the contacts 165 at a first sampling rate,such as once per clock cycle (e.g., on the rising edge of the clockcycle).

In the embodiment of FIG. 2A, in another example, such as when a secondtype microelectronic package 110 includes a plurality of microelectronicelements 130, a first group of first contacts 165 can be connected to afirst command-address signal bus of the set of conductors 170, which canbe connected to a first half of the microelectronic elements, and asecond group of contacts 165 can be connected to a secondcommand-address signal bus of the set of conductors, which can beconnected to a second half of the microelectronic elements. Thecomponent 105 may be configured such that when a second type of themicroelectronic package 110 having LPDDR3 memory therein is attached tothe component, the microelectronic elements 30 in the microelectronicpackage can be configured to sample the command and address informationcoupled thereto through a second number of the contacts 165 at a secondsampling rate, such as twice per clock cycle (e.g., once each on therising edge and falling edge of the clock cycle).

For example, a second type microelectronic package 110 can include aplurality of microelectronic elements 130, a first half of themicroelectronic elements being configured to connect with the firstcontacts 165 in a first group of first contacts but not with a secondgroup of first contacts, and a second half of the microelectronicelements being configured to connect with the first contacts in thesecond group of first contacts but not with the first group of firstcontacts. In such an embodiment, the set of conductors 170 can beconfigured to carry two identical sets of command-address signals, suchthat each half of the microelectronic elements 130 can be connected toone of the two sets of command-address signals of the set of conductors.An advantage of the invention is that the physical arrangement of theconductors 170 can be unchanged irrespective of the type ofmicroelectronic package 110 that is electrically connected thereto.

It is not required that all of the set of conductors 170 be used tocarry signals. For example, in one embodiment where the set ofconductors 170 is configured to carry two identical sets ofcommand-address signals, when the conductors are electrically connectedto a microelectronic package 110, it is not necessary that all of theconductors carry signals to the microelectronic package. Even when theset of conductors 170 is configured to carry two identical sets ofcommand-address signals, it is possible for the microelectronic assemblyto not use some or all of the conductors configured to carry theduplicate set of command-address signals, in order to reduce the numberof switching signals being carried by the set of conductors 170 toreduce power dissipation.

In a particular example, a second type microelectronic package 110 caninclude a single microelectronic element that is connected with thefirst contacts 165 in a first group of first contacts but not with asecond group of first contacts, such that the single microelectronicelement is connected with a first command-address signal bus of the setof conductors 170 but not with a second command-address signal bus ofthe set of conductors.

The component 105 can also include a device 180 coupled to the set ofconductors 170, the device operable to drive the command and addressinformation to the contacts 165. The device 180 can be configured tooperate in each of first and second modes for connection of thecomponent 105 with the first type microelectronic assembly 110 via thefirst arrangement of address and command information assignments, andwith the second type microelectronic assembly via the second arrangementof address and command information assignments, respectively, withoutalteration of the physical configuration of the conductors 170.

FIG. 2B illustrates a component 105 b according to a variation of theinvention shown in FIG. 2A. As seen in FIG. 2B, the component 105 bincludes a circuit panel 160 b having at least one row of exposedcontacts 164 adjacent an edge 163 of the circuit panel. The exposedcontacts 164 can be configured in one or more parallel rows, forexample, and the exposed contacts can be configured in any of the waysdescribed below with reference to FIGS. 3A-3C. The component 105 b canbe coupled to a second circuit panel 190 by inserting the edge 163 intoa corresponding socket 193 of the second circuit panel. The component105 b can be coupled to the circuit panel 190 in any of the waysdescribed below with reference to FIGS. 3A-3C.

The second circuit panel 190 can include a device 180 a coupled to a setof conductors 195 of the second circuit panel, the device operable todrive the command and address information to the contacts 165 of thecircuit panel 160 b. The component 105 b can include a device 180 bcoupled to the set of conductors. In one example, the device 180 b canbe a buffering element, or a protocol converter that is configured toconvert address information having a first protocol that can be used bythe component 5 or the circuit panel 190 to a second protocol that canbe used by the particular type of microelectronic element 130 in themicroelectronic assembly 110.

One or both of the devices 180 a and 180 b can be configured to operatein each of first and second modes for connection of the component 105with the first type microelectronic assembly 110 via the firstarrangement of address and command information assignments, and with thesecond type microelectronic assembly via the second arrangement ofaddress and command information assignments, respectively.

The circuit panel shown in any of the embodiments of described herein(e.g., the circuit panel 160 c of FIGS. 2C and 2D) can be a firstcircuit panel such as the circuit panel 160 b having a connectorinterface for electrical connection with a second circuit panel such asthe circuit panel 190, the connector interface being configured tocarrying information for transfer to and from the contacts 165. Aparticular example of such an arrangement is shown in FIG. 7, where aplurality of components 606, each of which can include a circuit panel160 b, are shown coupled to a second circuit panel 602 via a respectiveconnector interface.

In the example shown in FIG. 7, the connector interface can include asocket 605 having a plurality of contacts 607 at one or both sides ofthe socket, the socket being configured to receive a circuit panel suchas the circuit panel 160 b having corresponding exposed edge contactsdisposed at at least one edge 163 of the circuit panel. In otherembodiments, the connector interface between the circuit panel 160 c andthe second circuit panel 190 can be of the types shown in FIGS. 3A and3B, or, surface mount connections (e.g., BGA, LGA, etc.).

FIG. 2C illustrates a component 105 c including a circuit panel 160 cthat is configured for coupling to one or more microelectronic packages110 c. The circuit panel 160 c shown in FIGS. 2C and 2D is the samecircuit panel, and each of the FIGS. 2C and 2D shows a component 105 cincluding the circuit panel 160 c coupled to a different respectivemicroelectronic assembly 110 c or 110 d.

As can be seen in FIG. 2C, the circuit panel 160 c can define first andsecond surfaces 161, 162. The circuit panel 160 c can have at least oneset of contacts 168 exposed at the first surface 161 for connection withcorresponding surface mount terminals 125 and 127 (e.g., of type BGA,LGA, etc.) of a microelectronic package 110 c that incorporates one ormore microelectronic elements 131 having a memory storage array.

The circuit panel 160 c can have a plurality of sets of contacts 165 and167, each set 168 of the contacts 165, 167 being configured forconnection to a single microelectronic package 110 c. The contacts ineach set 168 can include first contacts 165 for carrying address andcommand information and second contacts 167 for carrying informationother than the command and address information (e.g., data input/outputinformation).

Similar to FIG. 2A, each set 168 of the contacts can have apredetermined arrangement that defines relative positions on the firstsurface 161 (or the second surface 162 if the set of contacts is exposedat the second surface) of contacts carrying address and commandinformation and data. The contacts in each set 168 can be arrangedaccording to the predetermined arrangement. The set 168 of the contactsthat can be arranged according to two different predeterminedarrangements for connection with two different types of themicroelectronic assembly 110, respectively, are also referred to hereinas a set of “co-support contacts.”

The circuit panel 160 c can be usable without requiring alterationthereof in first and second modes, each mode being when a given set 168of contacts is connected with terminals of a corresponding type ofmicroelectronic package 110 c or 110 d. For example, a component 105 ccan be joined with a first type microelectronic package 110 c (FIG. 2C)having first terminals 125 joined to first contacts 165 of the circuitpanel. In another example, the same component 105 c a second typemicroelectronic package 110 d (FIG. 2D) having first terminals 125joined to first contacts 165 of the circuit panel.

For example, in the first mode, the circuit panel 160 c can be coupledto a first type of microelectronic package 110 c that is operable tosample the address and command information carried by the first contacts165 once per clock cycle. Examples of such a first type ofmicroelectronic package include the microelectronic package 110 c havingfour microelectronic elements 131 a, 131 b, 131 c, and 131 d, as shownin FIG. 2C, or other numbers of microelectronic elements as will bedescribed below. Such a microelectronic package 110 c can includemicroelectronic elements 131 of type DDR3 or DDR4 (generally referred toas DDRx) or of type GDDR3 or GDDR4 (generally referred to as GDDRx).

In a particular example, in the second mode, the circuit panel 160 c canbe coupled to a second type of microelectronic package 110 d that isoperable to sample the address and command information carried by thefirst contacts 165 twice per clock cycle. Examples of such a second typeof microelectronic package include the microelectronic package 110 dhaving four microelectronic elements 132 a, 132 b, 132 c, and 132 d,shown in FIG. 2D, or other numbers of microelectronic elements as willbe described below. Such a microelectronic package 110 d can includemicroelectronic elements 132 of type LPDDR3 or LPDDR4 (generallyreferred to as LPDDRx).

In a particular embodiment, the one or more microelectronic elements 110c in the first type microelectronic package (e.g., the microelectronicpackage 110 c shown in FIG. 2C) can incorporate a different type ofmemory storage array than the one or more microelectronic elements inthe second type microelectronic package (e.g., the microelectronicpackage 110 d shown in FIG. 2D).

As can be seen in FIG. 2C, the circuit panel 160 c can include firstcontacts 165 in each set of contacts 168 that can include first andsecond groups of first contacts 165 a and 165 b. Each group of firstcontacts 165 a and 165 b can be assigned for carrying addressinformation usable to specify a location within the memory storage arrayof the one or more microelectronic elements 131.

When the circuit panel 160 c is connected to a first typemicroelectronic package such as the microelectronic packages 110 c shownin FIG. 2C, both of the first and second groups of first contacts 165 aand 165 b can be used to together specify a location within the memorystorage array of the one or more microelectronic elements 110 c.

In such an example, the first group of first contacts 165 a can beconnected to a first command-address signal bus F0 of the set ofconductors 170, which can be connected to each microelectronic element131, and the second group of contacts 165 b can be connected to a secondcommand-address signal bus F1 of the set of conductors, which can alsobe connected to each microelectronic element 131. In particularembodiments, a first type microelectronic package can include one or twomicroelectronic elements 131, each microelectronic element beingconfigured to connect with the first contacts 165 in each of the firstand second groups of first contacts 165 a, 165 b. In other embodiments,a first type microelectronic package can include more than twomicroelectronic elements 131, each microelectronic element beingconfigured to connect with the first contacts 165 in each of the firstand second groups of first contacts 165 a, 165 b.

In the example shown in FIG. 2C, the microelectronic package 110 c hasfour microelectronic elements 131, and each of those microelectronicelements can be connected to both the first and second command-addresssignal busses F0 and F1 of the set of conductors 170. In the exampleshown in FIG. 2C, each microelectronic element 131 a, 131 b, 131 c, and131 d can receive 16 bits of command-address signal information: 8 bitsfrom the signal bus F0, and 8 bits from the signal bus F1. Theseconnections between the signal busses F0 and F1 l and themicroelectronic elements 131 are schematically shown in FIG. 2C asconductors G0 that are connected with the signal bus F0 and conductorsG1 that are connected with the signal bus F1.

In a variation of the embodiment shown in FIG. 2C, the first typemicroelectronic package 110 c can have eight microelectronic elements131, and each of those microelectronic elements can be connected to boththe first and second command-address signal busses F0 and F1 l. In suchan example, each microelectronic element 131 can receive 16 bits ofcommand-address signal information: 8 bits from the signal bus F0, and 8bits from the signal bus F1.

Alternatively, when the circuit panel 160 c is connected to a secondtype microelectronic package such as the microelectronic packages 110 dshown in FIG. 2D, both of the first and second groups of first contacts165 a and 165 b can be used separately to each specify a location withinthe memory storage array of the one or more microelectronic elements 132a, 132 b, 132 c, and 132 d.

In such an example, the first group of first contacts 165 a can beconnected to a first command-address signal bus F0 of the set ofconductors 170, which can be connected to a first half of themicroelectronic elements 132, and the second group of contacts 165 b canbe connected to a second command-address signal bus F1 of the set ofconductors, which can be connected to a second half of themicroelectronic elements 132. For example, a second type microelectronicpackage can include a plurality of microelectronic elements 132, a firsthalf of the microelectronic elements being configured to connect withthe first contacts 165 in the first group of first contacts 165 a butnot with the second group of first contacts 165 b, and a second half ofthe microelectronic elements being configured to connect with the firstcontacts in the second group of first contacts 165 b but not with thefirst group of first contacts 165 a.

In a particular example, a second type microelectronic package caninclude a single microelectronic element 132 that is connected with thefirst contacts 165 in the first group of first contacts 165 a but notwith the second group of first contacts 165 b, such that the singlemicroelectronic element is connected with the first command-addresssignal bus F0 but not with the second command-address signal bus F1.

In FIG. 2D, the microelectronic package 110 d has four microelectronicelements 132 a, 132 b, 132 c, and 132 d. Two of those microelectronicelements 132 a and 132 b can be connected with the first group of firstcontacts 165 a but not with the second group of first contacts 165 b,such that the microelectronic elements 132 a and 132 b are connectedwith the first command-address signal bus F0 of the set of conductors170 but not the second command-address signal bus F1. Two of themicroelectronic elements 132 c and 132 d can be connected with thesecond group of first contacts 165 b but not with the first group offirst contacts 165 a, such that the microelectronic elements 132 c and132 d are connected to the second command-address signal bus F1 but notthe first command-address signal bus F0.

In this embodiment, each signal bus F0 and F1 is configured to carry twoidentical sets of command-address signals, such that each of the fourmicroelectronic elements 132 can be connected to one of the two sets ofcommand-address signals of a particular signal bus F0 or F1.

In one example of the embodiment shown in FIG. 2D, two of themicroelectronic elements 132 a and 132 b can receive 32 bits ofcommand-address signal information from the first command-address signalbus F0, and two of the microelectronic elements 132 c and 132 d canreceive 32 bits of command-address signal information from the secondcommand-address signal bus F1. In another example of the embodimentshown in FIG. 2D, two of the microelectronic elements 132 a and 132 bcan receive 16 bits of command-address signal information from the firstcommand-address signal bus F0, and two of the microelectronic elements132 c and 132 d can receive 16 bits of command-address signalinformation from the second command-address signal bus F1. Theseconnections between the signal busses F0 and F1 and the microelectronicelements 132 are schematically shown in FIG. 2D as conductors G0 thatare connected with the signal bus F0 and conductors G1 that areconnected with the signal bus F1.

In a variation of the embodiment shown in FIG. 2D, the second typemicroelectronic package 110 d can have two microelectronic elements 132.A first one of the microelectronic elements 132 can be connected withthe first group of first contacts 165 a but not with the second group offirst contacts 165 b, such that the first microelectronic element isconnected with the first command-address signal bus F0 but not with thesecond command-address signal bus F1. A second one of themicroelectronic elements 132 can be connected with the second group offirst contacts 165 b but not with the first group of first contacts 165a, such that the second microelectronic element is connected with thesecond command-address signal bus F1 but not with the firstcommand-address signal bus F0. In such an example, each microelectronicelement 132 can receive 32 bits of command-address signal informationfrom either the first command-address signal bus F0 or the secondcommand-address signal bus F1.

In the particular embodiment of the circuit panel 160 c shown in FIG.2C, each of the first contacts of the first group 165 a can have asignal assignment that is symmetric about a theoretical axis 174 withthe signal assignment of a corresponding first contact of the secondgroup 165 b. A first type microelectronic package such as themicroelectronic package 110 c having signal assignments that aresymmetric about a theoretical axis 174 or a second type microelectronicpackage such as the microelectronic package 110 d having signalassignments that are symmetric (e.g., address signal and no-connectsymmetry) about a theoretical axis can be mounted to the same circuitpanel 160 c.

Although the embodiments of the circuit panel 160 c shown herein havefirst contacts of the first group 165 a that have signal assignmentsthat are symmetric about a theoretical axis 174 (FIG. 2C) with signalassignments of corresponding first contacts of the second group 165 b,that need not always be the case. The invention described and claimedherein also contemplates circuit panels 160 c that have first contactsof the first group 165 a that have signal assignments that are notsymmetric about a theoretical axis with signal assignments ofcorresponding first contacts of the second group 165 b.

As can be seen in FIG. 2C, the circuit panel 160 c can further includesecond contacts 167 in each set of contacts 168, and such secondcontacts in each set of contacts can include first and second groups ofsecond contacts 167 a and 167 b. The second contacts 167 can be assignedfor carrying information other than the address and command information.The circuit panel 160 c can have at least one second bus F2, F3 of theset of conductors 171 that is electrically connected with at least someof the second contacts 167. Such a second bus F2, F3 can have aplurality of signal lines configured to carry information other than theaddress and command information.

In one example, each of the four microelectronic elements 131 can beelectrically connected with different signal lines within the set ofconductors 171. For example, the microelectronic element 131 a canreceive 16 bits of data signal information from a first half ofconductors of the signal bus F2, the microelectronic element 131 b canreceive 16 bits of data signal information from a second half ofconductors of the signal bus F2, the microelectronic element 131 c canreceive 16 bits of data signal information from a first half ofconductors of the signal bus F3, and the microelectronic element 131 dcan receive 16 bits of data signal information from a second half ofconductors of the signal bus F3. These connections between the signalbusses F2 and F3 and the microelectronic elements are schematicallyshown in FIGS. 2C and 2D as conductors G2 that are connected with thesignal bus F2 and conductors G3 that are connected with the signal busF3.

In one example, as can be seen in FIG. 2D, at least some of the secondcontacts 167 each of the at least one set of contacts 168 can bedisposed in first and second areas 167 a, 167 b adjacent to at leastfirst and second opposite edges 168 a, 168 b of a periphery of thepredetermined of the respective set of contacts, such that all of thefirst contacts 165 of the respective set of contacts can be disposedbetween the first and second areas of the respective set of contacts.

Also, in such an example, at least some of the second contacts 167 eachof the at least one set of contacts 168 can be disposed in third andfourth areas adjacent to at least third and fourth opposite edges of theperiphery of the predetermined of the respective set of contacts, thethird and fourth edges extending in a direction between the first andsecond edges 168 a, 168 b, such that all of the first contacts 165 ofthe respective set of contacts are disposed between the third and fourthareas of the respective set of contacts.

The circuit panel 160 c shown in any of the embodiments of FIGS. 2C and2D can have a first set of contacts 168 at the first surface 161 and asecond set of contacts 168 at the second surface 162, each of the firstand second contacts 165, 167 in each set of contacts 168 being arrangedaccording to the same predetermined arrangement. The circuit panel 160 cshown in any of the embodiments of FIGS. 2C and 2D can have a first setof contacts 168 at the first surface 161 and a second set of contacts168 at the first surface spaced apart from the first set in a directionparallel to the first surface, each of the first and second contacts165, 167 in each set of contacts 168 being arranged according to thesame predetermined arrangement.

In some embodiments, circuit panels 160 c having more than one set ofcontacts 168 can use the same channel of conductors 170 for carryingcommand and address information to each of the sets of contacts. Inother embodiments, circuit panels 160 c having more than one set ofcontacts 168 can use different channels of conductors 170, each channelof conductors being configured for carrying command and addressinformation to a different one of the sets of contacts.

FIG. 3A illustrates a component 205 a according to a particular exampleof the invention shown in FIG. 1. As seen in FIG. 3A, the component 205a includes a circuit panel 260, and the contacts 265 a are disposed in asocket 266 a attached to the first surface 261 of the circuit panel andelectrically connected with the set of conductors 270.

The microelectronic assembly joined to the circuit panel 260 a is amodule 210 a including a module card 220 a and one or moremicroelectronic elements 230 attached thereto, each microelectronicelement having a surface facing a first surface 221 of the module card.The microelectronic element 230 has address inputs 235 electricallyconnected to terminals 225 a of the module card 210 a. In a particularembodiment, the module 210 a can include a plurality of microelectronicelements 230 that are connected with busses F0, F1, F2, and F3 of theset of conductors 270 in the same manner as shown and described withrespect to FIG. 2C or FIG. 2D, depending on whether the microelectronicelements are of the first type or the second type.

As can be seen in FIG. 3A, the terminals 225 a are a plurality ofparallel exposed edge terminals adjacent an edge 223 of at least one ofthe first and second surfaces 221, 222 of the module card 220 a formating with the contacts 265 a of more sockets 266 a when the module isinserted in the socket. Although terminals 225 a are shown in FIG. 3Aexposed at both the first and second surfaces 221, 222 of the modulecard 220 a, terminals 225 a may be exposed at only the first surface,only the second surface, or both the first and second surfaces of themodule card.

As can be seen in FIG. 3C, the module card 220 a may have one row ofparallel exposed edge terminals 225 a adjacent the edge 223, a first rowof parallel exposed edge terminals 226 a and a second row of parallelexposed terminals 226 b adjacent the first row of terminals, or a firstrow of parallel exposed edge terminals 227 a and a plurality of rows ofparallel exposed terminals 227 b, 227 c (two additional rows 227 areshown in FIG. 3C, but the module card may include more than twoadditional rows), the second row of terminals 227 b being adjacent thefirst row of terminals 227 a, and the third row of terminals 227 c beingadjacent the second row of terminals 227 b. The module card 220 a mayhave notches 228 extending from the edge 223, such notches facilitatingregistration of the module card with a multi-part socket 266 a that isconfigured to receive the module card. Although the terminals 225, 226,and 227 shown in FIG. 3C are shown exposed at the first surface 221 ofthe module card 220 a, terminals 225, 226, and 227 may be exposed atonly the first surface, only the second surface 222, or both the firstand second surfaces of the module card.

FIG. 3B illustrates a component 205 b according to a variation of theinvention shown in FIG. 3A. As seen in FIG. 3B, the component 205 bincludes a circuit panel 260, and the contacts 265 b are disposed in aconnector 266 b attached to the first surface 261 of the circuit paneland electrically connected with the set of conductors 270. The terminals225 b of the module 210 b are a plurality of parallel terminals exposedat one of the first and second surfaces 221, 222 of the module card 220b for mating with the contacts 265 b of the connector 266 b when themodule is attached to the connector. In a particular embodiment, themodule 210 b can include a plurality of microelectronic elements 230that are connected with busses F0, F1, F2, and F3 of the set ofconductors 270 in the same manner as shown and described with respect toFIG. 2C or FIG. 2D, depending on whether the microelectronic elementsare of the first type or the second type.

Similar to the embodiment of FIG. 3A described above, the module card220 b may have two rows of parallel exposed terminals 225 b exposed at asurface of the module card, four parallel rows of exposed terminals(e.g., one additional row of parallel terminals disposed adjacent eachrow of terminals 225 b), or six or more parallel rows of exposedterminals (e.g., two or more additional rows of parallel terminalsdisposed adjacent each row of terminals 225 b). Also similar to theembodiment of FIG. 3A, the module card 220 b may have one or morenotches configured to facilitate registration of the module card with asocket 266 b that is configured to receive the module card.

In this embodiment, the socket 266 b, the contacts 265 b, and theterminals 225 b of the module 210 b are configured such that, when thewhen the module attached to the socket, the second surface 222 of themodule card 220 b is oriented substantially parallel to the firstsurface 261 of the circuit panel 260 b.

Although FIGS. 3A and 3B each show only a single module 210 a or 210 belectrically connected with the component 205 a or 205 b, in otherembodiments, a plurality of modules can be electrically connected withthe component. In such embodiments, all of the modules 210 a or 210 bcan be attached to the first surface 261 of the circuit panel 260 a or260 b, all of the modules can be attached to the second surface 262 ofthe circuit panel, or one or more modules can be attached to the firstsurface of the circuit panel and one or more modules can be attached tothe second surface.

Although FIGS. 3A and 3B show a module card 220 a or 220 b orientedsubstantially perpendicular (FIG. 3A) or parallel (FIG. 3B) to the firstsurface 261 of the circuit panel 260 a or 260 b, in other embodiments, amodule card of a module similar to the module 210 a or 210 b may beinclined at any other angle relative to the first surface of the circuitpanel, such as 15°, 30°, 45°, 60°, or 75°, for example.

Although FIGS. 3A and 3B show module cards 220 a, 220 b electricallyconnected to a circuit panel 260 a, 260 b via a socket 266 a, 266 b,other connection configurations may be used. For example, the inventioncontemplates module cards electrically connected to a circuit panelusing a ribbon connector extending between terminals of the module cardand contacts of the circuit panel.

FIG. 4A illustrates a component 305 according to another particularexample of the invention shown in FIG. 1. As seen in FIG. 4A, thecomponent 305 includes a circuit panel 360, and the contacts 365 areupper terminals of a second microelectronic assembly 340 exposed at afirst surface 347 of the second microelectronic assembly. The secondmicroelectronic assembly 340 is attached to the first surface 361 of thecircuit panel and is electrically connected with the set of conductors370. Lower terminals 345 of the second microelectronic assembly 340 areelectrically connected with corresponding contacts 375 exposed at thefirst surface 361 of the circuit panel 360.

The microelectronic assembly joined to the circuit panel 360 is in theform of a first microelectronic assembly 310. In the example shown inFIG. 4A, the microelectronic assembly 310 is a microelectronic packagehaving one or more microelectronic elements 330 therein having a surfacefacing a first surface 321 of a package substrate 320. In a particularembodiment, the first microelectronic assembly 310 can include aplurality of microelectronic elements 330 that are connected with bussesF0, F1, F2, and F3 of the set of conductors 370 in the same manner asshown and described with respect to FIG. 2C or FIG. 2D, depending onwhether the microelectronic elements are of the first type or the secondtype.

In a particular example, the microelectronic assembly 310 can include aplurality of stacked microelectronic elements 330 electricallyinterconnected by conductive structure such as through-silicon vias(“TSVs”). The microelectronic element 330 has address inputs 335electrically connected to terminals 325 exposed at a second surface 322of the substrate 320 opposite the first surface 321.

The second microelectronic assembly 340 includes a microelectronicelement 341 having active devices therein, and the upper terminals 365of the second microelectronic assembly are electrically connected withthe set of conductors 370 of the circuit panel extending through thesecond microelectronic assembly.

In the embodiment of FIG. 4A, the microelectronic elements 330 of thefirst microelectronic assembly (or microelectronic package) 310 can havememory storage array function, and the microelectronic element 341 ofthe second microelectronic assembly (or microelectronic package) 340 canhave microprocessor function.

In an exemplary embodiment, the microelectronic element 330 of the firstmicroelectronic assembly 310 can be directly electrically connected tothe microelectronic element 341 of the second microelectronic assembly340 by electrical connections that extend only within the first andsecond microelectronic assemblies, not within the circuit panel 360. Asused herein, a first microelectronic element of a first microelectronicassembly and a second microelectronic element of a secondmicroelectronic assembly are “directly” connected to one another whenthe electrical connections extending between the first and secondmicroelectronic elements extend only within the first and secondmicroelectronic assemblies, not within a structure external to the firstand second microelectronic assemblies (e.g., a circuit panel).

In one example, the electrical connections between the microelectronicelement 330 of the first microelectronic assembly 310 and themicroelectronic element 341 of the second microelectronic assembly 340can include interconnection elements extending in a direction normal tothe first surface 347 of the second microelectronic assembly at whichthe upper terminals (the contacts 365) of the second microelectronicassembly are exposed, the interconnection elements being configured forpackage-on-package stacking.

In one embodiment, the electrical connections between themicroelectronic element 330 of the first microelectronic assembly 310and the microelectronic element 341 of the second microelectronicassembly 340 can include a bond via array extending from the terminals365 of the second microelectronic assembly to contacts exposed at asurface 343 of a substrate of the second microelectronic assembly.

FIG. 4B illustrates a component 305 b that is a variation of thecomponent 305 of FIG. 4A, according to another particular example of theinvention shown in FIG. 1. As seen in FIG. 4B, the component 305 bincludes the same second microelectronic assembly 340 shown in FIG. 4A,but it does not include the circuit panel 360. A set of conductors 370is supported by and/or located within the substrate 342 of the secondmicroelectronic assembly 340. The set of conductors 370 is electricallyconnected with the contacts 365 at the first surface 347 of the secondmicroelectronic assembly 340. The component 305 b can be electricallyconnected with a circuit panel such as the circuit panel 360 throughterminals 345 exposed at a lower surface 344 of the secondmicroelectronic assembly 340.

FIG. 4C illustrates a component 305 c that is a variation of thecomponent 305 b of FIG. 4B, according to another particular example ofthe invention shown in FIG. 1. As seen in FIG. 4C, the component 305 cincludes a second microelectronic assembly 340 c that is similar to thesecond microelectronic assembly 340 shown in FIG. 4B, but it does notinclude the substrate 342. A set of conductors 370 c is supported byand/or located within a molded region 348 of the second microelectronicassembly 340 c. The set of conductors 370 c is electrically connectedwith the contacts 365 at the first surface 347 of the secondmicroelectronic assembly 340. The set of conductors 370 c canelectrically connect element contacts 349 of the microelectronic element341 with the terminals 345 exposed at a lower surface 344 of the secondmicroelectronic assembly 340 c.

FIG. 5A illustrates a component 405 according to yet another particularexample of the invention shown in FIG. 1. As seen in FIG. 5A, thecomponent 405 includes a circuit panel 460, and the contacts 465 areupper terminals of a second microelectronic assembly 440 exposed at afirst surface 447 of the second microelectronic assembly, or exposed ata dielectric layer (not shown) at a first surface of the secondmicroelectronic assembly. The second microelectronic assembly 440 isattached to the first surface 461 of the circuit panel and iselectrically connected with the set of conductors 470. Lower terminals445 exposed at a second surface 444 of the second microelectronicassembly 440 are electrically connected with corresponding contacts 475exposed at the first surface 461 of the circuit panel 460.

The microelectronic assembly joined to the circuit panel 460 is in theform of a first microelectronic assembly 410. In the example shown inFIG. 5A, the microelectronic assembly 410 is a microelectronic packagehaving one or more microelectronic elements 430 therein having a surfacefacing a first surface 421 of a package substrate 420. Themicroelectronic element 430 has address inputs 435 electricallyconnected to terminals 425 exposed at a second surface 422 of thesubstrate 420 opposite the first surface 421. In a particularembodiment, the first microelectronic assembly 410 can include aplurality of microelectronic elements 430 that are connected with bussesF0, F1, F2, and F3 of the set of conductors 470 in the same manner asshown and described with respect to FIG. 2C or FIG. 2D, depending onwhether the microelectronic elements are of the first type or the secondtype.

In the embodiment of FIG. 5A, the first microelectronic assembly 410 caninclude a first microelectronic element 430 and additionalmicroelectronic elements each having active devices therein. In oneexample, the terminals 425 of the first microelectronic assembly 410 canbe electrically connected with the additional microelectronic elementsby through-silicon vias extending through the first microelectronicelement 430.

The second microelectronic assembly 440 can include one or moremicroelectronic elements each having active devices therein, and theupper terminals 465 of the second microelectronic assembly can beelectrically connected with the set of conductors 470 of the circuitpanel by electrical connections extending at least partially within thesecond microelectronic package. The contacts (or upper terminals) 465can be exposed at a dielectric layer overlying the first surface 447 ofthe second microelectronic assembly 440. In an exemplary embodiment, oneor more of the microelectronic elements of the second microelectronicassembly 440 can have a logic function.

In a particular example, these electrical connections between the upperterminals 465 of the second microelectronic assembly 440 and the set ofconductors 470 can include through-silicon vias 446 extending throughthe one or more microelectronic elements. These electrical connectionscan also include by joining units extending between the lower terminals445 and corresponding contacts 475 exposed at the first surface 461 ofthe circuit panel 460.

In one example, the second microelectronic assembly 440 can include afirst microelectronic element and at least one second microelectronicelement, each microelectronic element having active devices therein, thefirst and second microelectronic elements arranged in a stackedconfiguration. In a particular embodiment, the upper terminals 465 ofthe second microelectronic assembly 440 can be electrically connectedwith the set of conductors 470 of the circuit panel 460 bythrough-silicon vias 446 extending through the at least one secondmicroelectronic element of the second microelectronic assembly. Althoughin FIG. 5A, each of the upper terminals 465 are shown as being alignedwith (in a horizontal direction) and connected to the through-siliconvias 446, it is not required that the upper terminals be aligned withthe through-silicon vias, nor is it required that all of the upperterminals be connected with these through-silicon vias.

Although the first and second microelectronic assemblies 410 and 440 areshown as packaged structures, that need not be the case. In oneembodiment, the first microelectronic assembly 410 can be amicroelectronic element having a memory storage array function, and thesecond microelectronic assembly 440 can be a microelectronic elementhaving logic function. Although the first microelectronic assembly 410is shown as having a flip-chip connection between the terminals 425 andthe contacts 465, that need not be the case. In one example, the firstmicroelectronic assembly 410 can be a microelectronic element having amemory storage array function that is oriented with a contact-bearingsurface thereof facing away from the upper surface 447 of the secondmicroelectronic assembly 440, and terminals 425 (which can be elementcontacts) of the first microelectronic assembly 410 can be wire-bondedto the contacts 465 at the upper surface of the second microelectronicassembly.

In a particular example, contacts 465 at the upper surface 447 of thesecond microelectronic assembly 440 can offer co-support ofmicroelectronic assemblies 410 having DDR3 or DDR4 memory elementstherein.

FIG. 5B illustrates a component 405 b that is a variation of thecomponent 405 of FIG. 5A, according to another particular example of theinvention shown in FIG. 1. As seen in FIG. 5B, the component 405 bincludes the same second microelectronic assembly 440 shown in FIG. 5A,but it does not include the circuit panel 460.

A set of conductors 470 b can be supported by and/or located within themicroelectronic elements of the second microelectronic assembly 440. Theset of conductors 470 b can include TSVs and/or redistribution tracesconnected to TSVs, for example. The set of conductors 470 can beelectrically connected with the contacts 465 at the first surface 447 ofthe second microelectronic assembly 340. The component 405 b can beelectrically connected with a circuit panel such as the circuit panel460 through terminals 445 exposed at a lower surface 444 of the secondmicroelectronic assembly 440. In the embodiment of FIG. 5B, one or moreof the microelectronic elements in the microelectronic assembly 440 canbe a support structure for the set of conductors 470 b, or a dielectriclayer overlying one of the microelectronic elements in themicroelectronic assembly can be a support structure for the set ofconductors.

Each of the examples illustrated and discussed above can be implementedwith microelectronic elements therein having contacts on faces thereofwhich either face in the same direction which the first surface of themicroelectronic assembly faces, or can face away from the direction inwhich the first surface of the microelectronic assembly faces. Thus, inparticular examples, the microelectronic assemblies may be as shown anddescribed in the examples of any of FIGS. 13-20 of commonly owned U.S.application Ser. No. 13/439,317, the disclosure of which is incorporatedby reference herein.

Although the examples described above refer to the microelectronicelements overlying a substrate, the substrate may be omitted in anappropriate case, as when the microelectronic elements are arrangedtogether within a molded unit, e.g., a wafer-level unit, in which adielectric layer may be formed on or above contact-bearing faces of themicroelectronic elements for supporting traces and electricalinterconnections thereon.

In other examples, microelectronic assemblies having multiple stackedmicroelectronic elements therein may be single or multiple stackimplementations as shown and/or described with reference to FIGS. 21-25of commonly owned U.S. application Ser. No. 13/439,317, the disclosureof which is incorporated by reference herein.

In still other examples, microelectronic assemblies having fourmicroelectronic elements therein may be as shown and described in FIG.9A-B, 9C, 9D, 9F, 9G, 9H, 12B, 12C or 12D of commonly owned U.S.application Ser. Nos. 13/337,565 and 13/337,575, or may be as shown anddescribed in FIG. 7A-B, 8, 11A, 11B, 11C, 11D, 12, 13B, 14B, or 14C ofcommonly owned U.S. application Ser. No. 13/354,747, the disclosures ofwhich are incorporated by reference herein.

The microelectronic packages and microelectronic assemblies describedabove with reference to FIGS. 1-5 above can be utilized in constructionof diverse electronic systems, such as the system 500 shown in FIG. 6.For example, the system 500 in accordance with a further embodiment ofthe invention includes a plurality of modules or components 506 such asthe microelectronic packages and/or microelectronic assemblies asdescribed above in conjunction with other electronic components 508, 510and 511.

In the exemplary system 500 shown, the system can include a circuitpanel, motherboard, or riser panel 502 such as a flexible printedcircuit board, and the circuit panel can include numerous conductors504, of which only one is depicted in FIG. 6, interconnecting themodules or components 506, 508, 510 with one another. Such a circuitpanel 502 can transport signals to and from each of the microelectronicpackages and/or microelectronic assemblies included in the system 500.However, this is merely exemplary; any suitable structure for makingelectrical connections between the modules or components 506 can beused.

In a particular embodiment, the system 500 can also include a processorsuch as the semiconductor chip 508, such that each module or component506 can be configured to transfer a number N of data bits in parallel ina clock cycle, and the processor can be configured to transfer a numberM of data bits in parallel in a clock cycle, M being greater than orequal to N.

In the example depicted in FIG. 6, the component 508 is a semiconductorchip and component 510 is a display screen, but any other components canbe used in the system 500. Of course, although only two additionalcomponents 508 and 511 are depicted in FIG. 6 for clarity ofillustration, the system 500 can include any number of such components.

Modules or components 506 and components 508 and 511 can be mounted in acommon housing 501, schematically depicted in broken lines, and can beelectrically interconnected with one another as necessary to form thedesired circuit. The housing 501 is depicted as a portable housing ofthe type usable, for example, in a cellular telephone or personaldigital assistant, and screen 510 can be exposed at the surface of thehousing. In embodiments where a structure 506 includes a light-sensitiveelement such as an imaging chip, a lens 511 or other optical device alsocan be provided for routing light to the structure. Again, thesimplified system shown in FIG. 6 is merely exemplary; other systems,including systems commonly regarded as fixed structures, such as desktopcomputers, routers and the like can be made using the structuresdiscussed above.

The microelectronic packages and microelectronic assemblies describedabove with reference to FIGS. 1-5 can also be utilized in constructionof an electronic system such as the system 600 shown in FIG. 7. Forexample, the system 600 in accordance with a further embodiment of theinvention is the same as the system 500 shown in FIG. 6, except thecomponent 506 has been replaced by a plurality of components 606.

Each of the components 606 can be or can include one or more of themicroelectronic packages or microelectronic assemblies described abovewith reference to FIGS. 1-5. In a particular example, one or more of thecomponents 606 can be a variation of the component 5 shown in FIG. 1, inwhich the support structure 60 includes exposed edge contacts, and thesupport structure of each component 5 can be suitable for insertion intoa socket 605.

Each socket 605 can include a plurality of contacts 607 at one or bothsides of the socket, such that each socket 605 can be suitable formating with corresponding exposed edge contacts of a correspondingcomponent 606 such as the above-described variation of the component 5.In the exemplary system 600 shown, the system can include a secondcircuit panel 602 or motherboard such as a flexible printed circuitboard, and the second circuit panel can include numerous conductors 604,of which only one is depicted in FIG. 7, interconnecting the components606 with one another.

In a particular example, a module such as the system 600 can include aplurality of components 606, each component 606 being theabove-described variation of the component 5. Each component 606 can bemounted to, and electrically connected with the second circuit panel 602for transport of signals to and from each component 606. The specificexample of the system 600 is merely exemplary; any suitable structurefor making electrical connections between the components 606 can beused.

Various features of the above-described embodiments of the invention canbe combined in ways other than as specifically described above withoutdeparting from the scope or spirit of the invention. It is intended forthe present disclosure to cover all such combinations and variations ofembodiments of the invention described above.

The following paragraphs additionally describe features and embodimentsof the invention:

A microelectronic package family, including

a plurality of microelectronic packages each having terminals forconnection with corresponding contacts of an external component and eachincluding a microelectronic element having a memory storage array havinga given number of storage locations, the terminals of eachmicroelectronic package being configured to receive correspondingcommand and address information specifying one of the storage locations,each microelectronic element having inputs connected with the terminalsof the respective microelectronic package,

wherein the microelectronic element of a first microelectronic packageof the family is configured to sample first command and addressinformation coupled thereto through the terminals of the first packageat a first sampling rate,

and the microelectronic element of a second microelectronic package ofthe family is configured to sample second command and addressinformation coupled thereto through the terminals of the second packageat a second sampling rate being greater than the first sampling rate,

the terminals of the first package being configured to connect to a setof contacts of the external component arranged according to a firstpredetermined arrangement for receipt of the first command and addressinformation, and the terminals of the second package being configured toconnect to a set of contacts of the external component arrangedaccording to a second predetermined arrangement for receipt of thesecond command and address information,

wherein the set of contacts arranged according to the secondpredetermined arrangement include at least some contacts occupyingidentical positions with the set of contacts arranged according to thefirst predetermined arrangement, the set of contacts arranged accordingto the second predetermined arrangement being fewer in number than theset of contacts arranged according to the first predeterminedarrangement.

Thus, for example, the microelectronic package 10 shown in FIG. 1 can inany of the foregoing embodiments be any of the types of packagesdescribed in the foregoing embodiments. The first type ofmicroelectronic package 110 c (FIG. 2C), for example, can include amicroelectronic element 131 configured to sample first command andaddress information coupled thereto through the terminals 125 of suchpackage at a first sampling rate. The second type of microelectronicpackage 110 d, for example, can include microelectronic element 132configured to sample second command and address information coupledthereto through the terminals 125 through the second package at a secondsampling rate greater than the first sampling rate.

As can be seen in FIG. 2C, the terminals 125 of the first package 110 ccan be configured to connect to a set of contacts 165 of the externalcomponent 105 c arranged according to a first predetermined arrangementfor receipt of the first command and address information. As can be seenin FIG. 2D, the terminals 125 of the second package 110 d can beconfigured to connect to a set of contacts 165 of the external component105 d arranged according to a second predetermined arrangement forreceipt of the second command and address information.

Referring to FIGS. 2C and 2D, the set 168 of contacts 165 arrangedaccording to the second predetermined arrangement can include at leastsome contacts occupying identical positions with the set of contactsarranged according to the first predetermined arrangement. The set 168of contacts 165 arranged according to the second predeterminedarrangement can be fewer in number than the set of contacts arrangedaccording to the first predetermined arrangement.

1. A component for connection with a microelectronic assembly which includes a set of terminals and a microelectronic element having a memory storage array having a given number of storage locations, the microelectronic element of the assembly having inputs connected with the terminals for receiving command and address information specifying one of the storage locations, the component comprising: a support structure bearing a set of conductors configured to carry the command and address information; and a plurality of contacts coupled to the set of conductors, the contacts configured for connection with corresponding ones of the terminals of the microelectronic assembly, wherein the contacts have address and command information assignments arranged according to (a) a first predetermined arrangement for connection with a first type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through the contacts at a first sampling rate, the contacts having a first number thereof, and according to (b) a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts including a second number of the contacts at a second sampling rate being greater than the first sampling rate, the subset including some contacts occupying identical positions with the contacts that are assigned to the first predetermined arrangement, the second number being fewer than the first number.
 2. The component of claim 1, wherein all of the contacts of the subset of contacts arranged according to the second predetermined arrangement occupy identical positions with the contacts that are assigned to the first predetermined arrangement.
 3. The component of claim 1, wherein the second sampling rate is an integer multiple of the first sampling rate.
 4. The component of claim 1, further comprising a device coupled to the set of conductors, the device being operable to drive the command and address information to the contacts.
 5. The component of claim 4, wherein the device is a microprocessor.
 6. The component of claim 4, wherein the device is a buffering element.
 7. The component of claim 4, wherein the device is configured to operate in each of first and second modes for connection of the component with the first type microelectronic assembly via the first arrangement, and with the second type microelectronic assembly via the second arrangement, respectively.
 8. The component of claim 1, wherein the component is a circuit panel, and the contacts are exposed at a surface of the circuit panel.
 9. The component of claim 8, wherein the microelectronic assembly is a microelectronic package, and wherein the terminals are surface mount terminals and are exposed at a surface of the microelectronic package.
 10. The component of claim 1, wherein the component is a circuit panel, and the contacts are disposed in a socket electrically connected with the circuit panel.
 11. The component of claim 10, wherein the microelectronic assembly includes a module card having first and second opposed surfaces, and wherein the terminals are a plurality of parallel exposed terminals at at least one of the first and second surfaces for mating with the contacts of the socket when the module is inserted in the socket.
 12. The component of claim 1, wherein the component is a circuit panel and the contacts are disposed in a connector electrically connected with the circuit panel, wherein the microelectronic assembly includes a module card having first and second opposed surfaces, and wherein the terminals are a plurality of terminals exposed at one of the first and second surfaces for mating with the contacts of the connector when the module is attached to the connector.
 13. The component of claim 1, wherein the microelectronic assembly is a first microelectronic assembly and the component is a second microelectronic assembly, and the contacts are terminals of the second microelectronic assembly.
 14. The component of claim 13, wherein the second microelectronic assembly is coupled to the support structure and includes a microelectronic element having active devices therein, and wherein the terminals of the second microelectronic assembly are coupled with the microelectronic element of the second microelectronic assembly by electrical connections that extend only within the second microelectronic assembly.
 15. The component of claim 14, wherein the electrical connections between the terminals of the second microelectronic assembly and the microelectronic element of the second microelectronic assembly include interconnection elements extending in a direction normal to a surface of the second microelectronic assembly at which the terminals of the second microelectronic assembly are exposed, the interconnection elements being configured for package-on-package stacking.
 16. The component of claim 13, wherein the second microelectronic assembly is coupled to the support structure and includes a microelectronic element having active devices therein, the terminals of the second microelectronic assembly being exposed at a surface of the microelectronic element of the second microelectronic assembly.
 17. The component of claim 16, wherein the microelectronic element of the second microelectronic assembly is a first microelectronic element, the second microelectronic assembly further comprising at least one second microelectronic element each having active devices therein, the first and second microelectronic elements arranged in a stacked configuration.
 18. The component of claim 17, wherein the terminals of the second microelectronic assembly are electrically connected with the set of conductors of the support structures by through-silicon vias extending through the at least one second microelectronic element.
 19. The component of claim 16, wherein the microelectronic element of the second microelectronic assembly includes a logic function.
 20. The component of claim 1, wherein the contacts are first contacts and the conductors are a first set of conductors, the component further comprising a plurality of second contacts coupled to a second set of conductors, the second contacts configured for connection with corresponding terminals of the microelectronic assembly, the second contacts being configured to carry information other than the command and address information.
 21. The component of claim 1, wherein the contacts are first contacts and the conductors are a first set of conductors, the component further comprising a plurality of power and ground contacts coupled to a second set of conductors, the power and ground contacts configured for connection with corresponding terminals of the microelectronic assembly, the power and ground contacts being configured to carry a power potential and a reference potential, respectively.
 22. The component of claim 21, wherein when the first contacts have assignments arranged according to the second predetermined arrangement, the microelectronic element of the second type of the microelectronic assembly is configured to connect with the power and ground contacts, the power and ground contacts having a third number thereof, and wherein when the first contacts have assignments arranged according to the first predetermined arrangement, the microelectronic element of the first type of the microelectronic assembly is configured to connect with a subset of the power and ground contacts including a fourth number of the power and ground contacts, the fourth number being fewer than the third number.
 23. The component of claim 1, wherein the microelectronic element in the first type of the microelectronic assembly is of type DDRx, and the microelectronic element in the second type of the microelectronic assembly is of type LPDDRx.
 24. The component of claim 1, wherein the microelectronic element in the first type of the microelectronic assembly is of type GDDRx.
 25. A system comprising a component as claimed in claim 1 and one or more other electronic components electrically connected to the component.
 26. A component for connection with a microelectronic assembly which includes a set of terminals and a microelectronic element having a memory storage array having a given number of storage locations, the microelectronic element of the assembly having inputs connected with the terminals for receiving command and address information specifying one of the storage locations, the component comprising: a support structure bearing a set of conductors configured to carry the command and address information; and a plurality of contacts coupled to the set of conductors, the contacts configured for connection with corresponding ones of the terminals of the microelectronic assembly, wherein the contacts have address and command information assignments arranged according to (a) a first predetermined arrangement for connection with a first type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a first subset of the contacts including a first number of the contacts, and according to (b) a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a second subset of the contacts including a second number of the contacts, the first and second subsets including some contacts occupying identical positions, the second number being fewer than the first number.
 27. The component of claim 26, wherein the command and address information of the first type of the microelectronic assembly includes parity information, the microelectronic element in the first type of the microelectronic assembly is configured to sample the parity information, and the second subset of the contacts for connection with the second type of the microelectronic assembly is not configured to sample the parity information.
 28. The component of claim 26, wherein the microelectronic element in the second type of the microelectronic assembly is of type DDR3, and the microelectronic element in the first type of the microelectronic assembly is of type DDR4.
 29. The component of claim 28, wherein the command and address information of the first type of the microelectronic assembly having the DDR4 type microelectronic element includes parity information, and the DDR4 type microelectronic element in the first type of the microelectronic assembly is configured to sample the parity information.
 30. The component of claim 26, wherein the microelectronic element in the second type of the microelectronic assembly is of type DDRx, and the microelectronic element in the first type of the microelectronic assembly is of type DDR(x+1). 